1. Exadata Server X11M Service Manual
  2. Servicing Processors
  3. Identify and Remove a Processor

Identify and Remove a Processor

  • Use ESD gloves (not latex or vinyl), if possible, when handling the processor.

  • Obtain a torque driver set to 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) force with T20 Torx bit for processor and heatsink removal.

  • Be careful not to touch the processor socket pins.

    Caution:

    The processor socket pins are very fragile. A light touch can bend the processor socket pins beyond repair.

  • Remove thermal grease from the processor and any on the socket assembly before removing the carrier with the processor.

  • If thermal grease falls into the socket, there is no way to remove it without damaging the socket.

  • Do not allow the thin layer of thermal grease between the heatsink and the processor to contaminate the workspace or other components.

  • Failure to remove and replace thermal grease with new thermal grease can result in processor overheating.

  • Never remove the processor from the carrier. Replacement processors come with a carrier package. Figure showing the processor carrier frame.

  • Whenever you remove a processor on a usable motherboard, replace it with another processor and reinstall the processor heatsink; otherwise, the server might overheat due to improper airflow. See Install a Processor.

  1. Prepare the server for service.
    1. Power off the server.
    2. Disconnect the power cords from the power supplies.
    3. Extend the server to the maintenance position.
    4. Attach an antistatic wrist strap to your wrist, and then to a metal area on the chassis.
    5. Remove the server top cover.

      Use a Torx T15 screwdriver to unlock the release button latch.

      See Remove the Server Top Cover.

    6. Remove the air baffle.

      Remove the air baffle (sitting over the two processors) by lifting the baffle up and out of the server. Lift up the air baffle in the rear at a 50 degree angle, and slide slightly rearward to clear the air baffle tabs that prevent the front of the baffle from lifting up. Set aside the air baffle.

      See Remove the Air Baffle.

  2. Identify the location of the failed processor by pressing the Fault Remind button on the motherboard.

    Note:

    When you press the Fault Remind button, an LED located next to the Fault Remind button illuminates green, indicating that there is sufficient voltage in the fault remind circuit to illuminate any fault LEDs that were illuminated due to a failure. If this LED fails to illuminate when you press the Fault Remind button, it is likely that the capacitor powering the fault remind circuit lost its charge. This can happen if you press the Fault Remind button for a long time with fault LEDs illuminated, or if power was removed from the server for more than 15 minutes.

    The processor fault LED for the failed processor illuminates. The processor fault LEDs are located next to the processors. See Motherboard Status Indicators.

    • If the processor fault LED is off, the processor is operating properly.

    • If the processor fault LED is illuminated (amber), the processor failed and you must replace it.


    Figure showing how to identify a faulty processor by pressing the Fault Remind button.

    Callout Description

    1

    Fault Remind circuit power LED - green

    2

    Fault Remind button

    3

    Processor 0 fault LED - amber

    4

    Processor 1 fault LED - amber
  3. Using a Torx T20 screwdriver, loosen the six captive screws that secure the heatsink to the socket.
    Figure showing loosening processor-heatsink module six captive screws.

    Loosen in reverse order 6-1, then go back and disengage completely.

    1. Loosen captive screws 6,5,4,3,2,1 in the order shown in the illustration.

    2. Disengage captive screws 6,5,4,3,2,1 in the order shown in the illustration.

    Figure showing the processor heatsink screw loosening order.

    Use a torque driver set to 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) force with T20 Torx bit.

  4. Lift the heatsink from the socket.

    Caution:

    There is a thin layer of thermal grease between the heatsink and the processor. Do not allow the thermal grease to contaminate the workspace or other components.

    Note:

    Always grip the heatsink along the axis of the fins to prevent damage.

    Figure showing processor-heatsink module being removed from the socket.
  5. Place the heatsink, facing up, on a work surface.
  6. Remove Thermal Grease.

    Clean off the thermal interface material (TIM) using the supplied alcohol wipes.

    If reusing a processor, do not remove it from the processor carrier.

    Follow these steps if you plan on reusing either the heatsink or processor.

    1. Gather Thermal Grease Removal Materials required.
      1. 1. Techwipes or similar low-lint and low-abrasion wipe
      2. 2. Isopropyl alcohol (90% or above recommended)
      3. 3. Torx T20 screwdriver
      4. 4. SP5 socket protective lid

      Note:

      Some thermal greases may be classified as hazardous waste and should be disposed of in proper hazardous waste collection bins.
    2. Wipe the heatsink with a dry wipe to remove most of the thermal grease. Then add a small amount of isopropyl alcohol to a wipe and rub until there is no grease remaining.
      Figure showing wiping the heatsink with a dry wipe.

      Caution:

      Failure to clean thermal grease from the heatsink could result in the accidental contamination of the processor socket or other components. Be careful not to get the grease on your fingers, as this could result in contamination of components.
    3. Wipe the processor lid with a dry wipe to remove most of the thermal grease.
      Figure showing a dry wiped processor lid.
    4. Unscrew the socket Force Frame.
      Using a Torx T20 screwdriver, loosen the captive Force Frame Retention Screw that secures the Force Frame to the socket. Figure showing the force frame being loosened.
    5. Lift the Force Frame to the open position.

      Apply counter-pressure to the Force Frame when opening.

      Figure showing open position of the socket Force Frame.
    6. Open the Rail Frame.
      Squeeze the blue tabs to release the Rail Frame. Figure showing tabs of the socket Rail Frame.
    7. Lift the Rail Frame and slide out the carrier frame package.

      Lift the Rail Frame by holding its lift tabs and rotating the Rail Frame to its near vertical position.

      Figure showing the lifting of the Rail Frame to its vertical position.

      Note:

      The Rail Frame is spring-loaded. Hold on to the Rail Frame as it releases from the socket frame, when rotating it to the vertical position.
    8. Holding the processor carrier by its handle, slide the carrier out of the Rail Frame.
      Figure showing the removal of the processor package.
    9. Place the carrier frame package in an appropriate tray.
      Figure showing tray with carrier frame.
    10. Wipe the Force Frame (retention frame) with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.

      Clean off the thermal interface material (TIM) as needed, wipe the outside and inside of the Force Frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.

      Figure showing wiping the Force Frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.
    11. Wipe the processor lid and carrier frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.
      Clean off the thermal interface material (TIM) from the processor using the supplied alcohol wipes.

      Figure showing cleaning the Processor Lid in tray.