Device name

• Product Identifier: SSDPF2KX038T1S
• Oracle Part Number: 8210609
• Device Identification:
  • PCIe Vendor ID: 0x8086
  • PCIe Device ID: 0x0B60
  • Subsystem PCIe Vendor ID: 0x108E
  • Subsystem ID 0x488E

Marketing Part Number

7605207: 3.84 TB 2.5-inch NVMe PCIe 4.0 SSD v2 mix use with 2.5-inch bracket

Manufacturing name

3.84TB Intel D7-P5520, 3D NAND TLC SFF 2.5-inch Solid State Drive

Form factors

• 2.5-inch SFF (small form factor): U.2
• SFF-8639 compatible connector

PCIe interface

PCIe Gen4 Interface, x4 lanes

Features

• NVMe PCIe Gen4 Interface
• NVMe-MI rev 1.1 (MCTP)
• VPD per NVMe-MI Ver 1.1 specification
• Opal 2.0

Product Compliance

• NVM Express Specification Rev. 1.4
• PCI Express Base Specification Rev. 4.0
• Enterprise SSD Form Factor Version 1.0a
• NVMe-MI Rev 1.1

Product ecological compliance

RoHS

Certifications and declarations

cUL-us, CE, TUV-GS, CB, CE, BSMI, KCC, Morocco, VCCI, RCM, FCC, IC

Capacity, formatted

Default Formatted Capacity: 3,840,755,982,336 bytes

Sector Size (LBA size): 512 bytes per sector

Capacity, unformatted

Unformatted Capacity (Total User Addressable LBA): 7,501,476,528 (max 3.84 TB)

Capacity, raw NAND

4416 GiB

Random 4 KB Read

1 M IOPS

Typical 4 KB Random Read QD=1, Worker=1: 75us

Random 4 KB Write

Random 4 KB Write 200K IOPS

Typical 4 KB Random Write QD=1, Worker=1: 15us

Sequential Read

128 KB, QD 128, Worker=1: 6,700 MB/s

Sequential Write

128 KB, QD 128, Worker=1: 3,600 MB/s

Interface data transfer rate

• Interface Data Rate: PCIe Gen 4

• Data Transfer Rate 16 GT/sec

• Interface drivers/receivers SFF: 1x4 lanes

Operating temperature (Case)

0 to 70 degrees Celsius

Non-Operating temperature

-40 to 85 degrees Celsius

Maximum temperature (SMART trip)

Thermal Throttling at 70 degrees Celsius (SMART) when approaching maximum temperature. Thermal Shutdown at 80 degrees Celsius (SMART)

Error rates

Uncorrectable Bit Error Rate (UBER): 1 sector per 10^17 bits read

Data retention

3 months powered off at 40 degrees Celsius at end of rated endurance

Endurance

• Drive Writes Per Day (DWPD) for 5 years: 1

• PBW (at 4KB Random Write) 13.7 PB

Refer to the JEDEC JESD218A standard for SSD device life and endurance measurement techniques.

Component Design Life (Useful life)

5 years

MTBF

2,000,000 hours

Expected AFR (Annualized Failure Rate)

0.44% for normal 24x7 operating conditions

Power On to Ready (no rebuild)

RTD3R: 4 seconds

Power On to Ready (full rebuild)

19 seconds

Supply Voltage / Tolerance

12 V +10%/-20%

3.3 Vaux +/-15%

Inrush Current

12 V, 1.5 A

Power Consumption

• Active Read: 15 W

• Active Write: 15 W

• Idle < 5 W

• Max Burst: 20 W

15.0 mm +/-0.5 mm

69.85 +/-0.25 mm

100.45 mm Max

165 +/- 5 g

Minimum operating system versions

Refer to the server product notes for minimum operating system versions, hardware, firmware, and software compatibility.

Life monitoring capability

Provides alerts for proactive replacement of the drive before the endurance is depleted. Provides endurance remaining in NVMe SMART logs. SSD supports the standard method defined by NVMe for Solid State Drive to report NAND wear through the “Get Log” command SMART/Health Information Percentage Used field. The units are whole percentage of wear.

Percentage Used: Contains a vendor specific estimate of the percentage of NVM subsystem life used based on the actual usage and the manufacturer’s prediction of NVM life. A value of 100 indicates that the estimated endurance of the NVM in the NVM subsystem has been consumed, but may not indicate an NVM subsystem failure. The value is allowed to exceed 100. Percentages greater than 254 are represented as 255. This value is updated once per power-on hour (when the controller is not in a sleep state).

Refer to the JEDEC JESD218A standard for SSD device life and endurance measurement techniques.

End-to-End data-path protection

T10 DIF Type 0, Type 1, Type 2, Type 3, no performance impact. T10 DIF (data integrity field) end-to-end data protection includes multiple levels of data-path protection.

Enhanced power-loss data protection

Energy storage components complete buffered writes to the persistent flash storage in case of a sudden power loss.

Power loss protection capacitor self-test

Supports testing of the power loss capacitor. Power is monitored using SMART (Self-Monitoring, Analysis, and Reporting Technology) attribute critical warning.

Out-of-Band Management (SMBUS)

Managed through the SMBUS. Provides out-of-band management by means of SMBUS interface. This requires 3.3V auxiliary voltage. SMBUS access includes NVMe-MI, the VPD page and temperature sensor.

Hot-Plug Support

Supports PCIe presence detect and link-up detect. Device advanced power loss protection provides robust data integrity. During IOs, the storage drive integrated monitoring enables the integrity of already committed data on the media and commits acknowledged writes to the media.

Management utilities

For more information about management utilities, refer to the server documentation.

(1) Ready to Remove

Blue

OFF – The drive has not been prepared for removal. Normal operation.

STEADY ON – The drive is in standby power state. The drive can be removed safely during a hot-plug operation. A lit Ready to Remove indicator indicates that service action is allowed on the drive.

(2) Service Action Required

Amber

OFF – Normal operation.

STEADY ON – Service action is required. The system has detected a fault with the drive.

BLINKING – Locater. Status indicator blinks on and off to locate drive.

(3) Power/OK/Activity

Green

STEADY ON (does not blink) – Drive is engaged and is receiving full power. Normal operation.

RANDOM BLINKING – There is drive activity. Status indicator blinks on and off to indicate activity.

OFF – Power is off, or installed drive is not recognized by the system.